Samsung on Tuesday outlined what applications the 2 nanometer (nm) process will be available for in the coming years.
The South Korean tech giant said it will begin mass production of 2nm chips for use in mobile applications by 2025, during the Samsung Foundry Forum held in San Jose, California.
This means it will deliver the application processors used in smartphones and tablets in the 2nm process to customers who want to launch the processor at that size.
The nm measurement refers to the channel length of the transistors that comprise a chip. Advanced processors have billions of transistors, and their smaller channel lengths mean more transistors can be packed into a single chip, making them perform better.
Samsung Foundry, the tech giant’s contract chip manufacturing business, provides its manufacturing services to customers like Qualcomm and Samsung’s smartphone business unit.
After 2025, Samsung said it will provide the 2nm chip manufacturing process for high-performance computing by 2026 and by 2027 it will provide the process for automotive chips.
The company says its 2nm process has shown a 12% and 25% increase in efficiency and power efficiency, respectively. compared to the 3nm process it launched last year, a first among chipmakers. Samsung says its 2nm process also offers 5% smaller chips than the 3nm process.
Meanwhile, the company reiterated that it will begin mass production of chips using the 1.4nm process in 2027.
In 2025, it will also start offering contract manufacturing of 8-inch gallium nitride (GaN) power management chips as well as 5nm RF chips. It will also start offering 8nm and 14nm RF chips for automotive applications.
In addition, Samsung is aiming to expand cleanroom capacity to 7.3 times by 2027 compared to 2021. This will be achieved through the expansion of the plant in Pyeongtaek __ its most advanced facility for to date __ and a new factory is under construction in Taylor, Texas, the company said. More clean room means it will have more space to fulfill more orders from customers.
At the forum, Samsung also announced the establishment of the Multi-Mold Integration Alliance, an alliance with partners to apply new chip packaging technologies.
Samsung is the world’s second-largest contract chipmaker after TSMC, which makes Apple’s A series of chips used in iPhones.
