Dimensity 1300 is now officially the new high-performance chipset from MediaTek. Here are all the details.
Density 1300 just announced! MediaTek just unveiled the successor to last year’s popular Dimensity 1200 chipset. This chipset is expected to offer a slight performance upgrade over its predecessor and should match the Snapdragon 778G chipset that powers the majority of mid-range Android smartphones. MediaTek has yet to announce which phones will get the chipset first but the rumors suggest OnePlus device gets it before anyone else.
The Dimensity 1300 is based on TSMC’s 6nm fabrication process and features an eight-core processor, including the same 1+3+4 configuration. The Ultra Cortex-A78 cores are running at 3GHz while the normal performance cores are running at 3GHz. running at 2.6GHz. Four efficient Cortex-A55 cores are running at 2GHz. MediaTek is using a 9-core Mali-G77 MC9 GPU, which improves performance.
Dimensity 1300 is here
MediaTek says that the Dimensity 1300 can support FHD+ displays with a refresh rate of up to 168Hz. This chip can support up to 16GB of LpDDR4X RAM and UFS 3.1 memory. The ISP can support camera sensors up to 200MP resolution and can also record 4K HDR video. And of course, it supports 5G networks.
“Density 1300 increases AI benchmarks from the six-core 3.0 APU by up to 10%, providing greater capabilities for AI tasks. The MediaTek APU 3.0 features an advanced multi-task scheduler to maximize performance and efficiency while handling multiple concurrent tasks,” said MediaTek.
“MediaTek HyperEngine 5.0 offers a comprehensive set of gaming-related optimizations such as proprietary AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, along with wireless headset latency improvements from Bluetooth technology. LE Audio with Dual-Link True Wireless Stereo Audio”, adds MediaTek.
And like last year, MediaTek has opened up for manufacturers to customize chips to their specific needs. The Dimensity 5G Open Resource Architecture enables device manufacturers to create unprecedented and truly outstanding 5G smartphones.
While the Dimensity 1300 breaks the envelope, there are reports of the Dimensity 8000 series of chips being made for global markets including India in the new lineup. Xiaomi 12 series devices. In addition, there have been reports of Samsung is considering using MediaTek chips for the upcoming Galaxy S22 FE as well as Galaxy S23 series devices in some Asian markets in an effort to keep prices low.
